Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to ...

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

WASHINGTON, May 23 (Reuters) - The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025. Save my User ID and Password Some ...

In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging for sanctions ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...