HAIFA, Israel--(BUSINESS WIRE)--proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its ...

Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies "The adoption of Edge AI applications ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

We had the opportunity to interview TSMC's Kevin Zhang, the deputy co-COO and SVP at TSMC, to discuss the latest trends in the semiconductor industry and how they impact TSMC's strategy moving forward ...

LONDON & TORONTO--(BUSINESS WIRE)--Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

The rising costs of AI chips driven by advanced process technologies have continued to escalate, while the direct performance gains from these process improvements have significantly diminished.

Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate ...