1.1. CMP 工艺是晶圆全局平坦化的关键工艺 晶圆制造流程可以广义地分为晶圆前道和后道 2 个环节，其中前道工艺在晶圆厂中进行，主要负责晶圆的加工制造，后道工艺在封测厂中进行，主要负责芯片的封装测试，其中，化学机械抛光（CMP）是实现晶圆全局平坦化 ...

Tighter control of particle size and large particle counts reduces defects, improves CMP consistency, and protects yield in ...

At the semicon west semiconductor equipment and materials trade show in San Francisco last month, competing announcements spelled potential trouble for companies in the fast-growing business of ...