Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...

Using a wafer-level package (WLP) can reduce the overall size and cost of your solution. However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, if not ...