Abstract: The purpose of this study is to investigate the thermal interaction of layers of 3D printed components. Thermal bond formation happens as a result of the raw material’s molten condition and ...

Abstract: 3D instance segmentation (3DIS) aims to identify object instances in a 3D scene by predicting binary foreground masks with corresponding semantic labels. Transformer-based methods have ...

The block size of flash memory chips has increased significantly with the introduction of 3D NAND technology, causing "big-block" management issues in storage systems. In this paper, we characterize ...