A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

Abstract: This research paper investigates the use of flux-sprayed solder preforms as an alternative method to reduce flux outgassing in reflow soldering. The study compares the flux volume, void ...

Abstract: During reflow soldering of BGA. voids are very easily produced in the solder joints. Void formation in solder joints is one of the many critical factors governing the solder joint ...

The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...