Addressing critical advanced packaging challenges in chipmaking
siliconsemiconductor.net
Addressing critical advanced packaging challenges in chipmaking
Ming Li, vice president of strategic projects (dielectrics), Deposition Product Group at Lam Research, discusses the recent launch of the company’s VECTOR® TEOS 3D - a breakthrough dielectric film deposition system developed specifically for advanced packaging, as part of Lam’s broader portfolio – which is currently installed (or being ...
5 个月之前
Microelectronics Projects
Vinod Dham Centre of Excellence for Semiconductors & Microelectronics inaugurated in Delhi. Strong focus on talent development for India’s semiconductor ecosystem. ✅ Chips to Start-up program: - Over 1 lakh students (B-Tech/ M-Tech/ PhD) onboarded - 263 institutions supported with world-class EDA tools - 65 R&D projects at 113 organisations - SMART lab at Nielit, Calicut - 170 trainings by ChipIN centre ✅ 20 ASICs fabricated at SCL foundry & 14 ASICs sent for fabrication. | Ashwini Vaishnaw
1:29
Vinod Dham Centre of Excellence for Semiconductors & Microelectronics inaugurated in Delhi. Strong focus on talent development for India’s semiconductor ecosystem. ✅ Chips to Start-up program: - Over 1 lakh students (B-Tech/ M-Tech/ PhD) onboarded - 263 institutions supported with world-class EDA tools - 65 R&D projects at 113 organisations - SMART lab at Nielit, Calicut - 170 trainings by ChipIN centre ✅ 20 ASICs fabricated at SCL foundry & 14 ASICs sent for fabrication. | Ashwini Vaishnaw
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